Technologies
COMPEL GROUP disposes of sophisticated and
consolidated Technologies, which range from specific surface treatments
to Thick & Thin Film Substrates, from up-to-date SMT Lines
to powerful Chip & Wire Lines.
These facilities represent a great advantage to optimize in cost
and performance COMPEL GROUP’s products, as well as customers
products and requirements.
The Thin Film facility is based on a 600 sqm clean room (Class
100/1,000) equipped with Metal Deposition machines, Wet and
Dry Etching Systems, Photolithography, Electroplating (Cu
and Au), ceramic Dicing and Laser Cutting/Drilling, Laser
Trimming, Pattern Generator and Automated Test Equipment (www.filtech.it) |
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Chip & Wire
Lines are situated in a 1300 sqm clean room (Class 10,000) and are equipped
with Automatic solder paste and glue Dispensing, Automatic component
Placement (SMD and Die), Substrate, SMD and Die attachment,
Plasma Cleaning, Automatic wire and ribbon Bonding, Package Sealing
& hermeticity test and Automated Test Benches (www.teleoptix.com).
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